Please confirm you are human
This browser or connection looks automated. Press and continuously hold the control for 3 seconds to enable Google-hosted web results and, when separately allowed, AI-assisted answers.
A successful check enables 100 search requests. Interactive access does not authorize scraping, systematic collection, or reuse of search output.
News
Taiwan and South Korea Turn AI Rivalry into a Critical Chip Partnership
2+ hour, 9+ min ago (588+ words) The technology race is entering a new phase, where fierce competitors must depend on each other to satisfy an unprecedented demand for computing power. Taiwanese and South Korean companies are seeking to supply the global market with AI accelerators – specialized…...
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
2+ hour, 41+ min ago (141+ words) digitimes Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory Keep me signed in - Track financials & stock data of Taiwan tech. - Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge - 2027 memory capacity reportedly…...
d-Matrix Challenge 3: DRAM Reliability at 105??C
3+ hour, 48+ min ago (17+ words) d-Matrix Challenge 3: DRAM Reliability at 105°C ServeTheHome d-Matrix Challenge 3: DRAM Reliability at 105°C...
d-Matrix Building a 3D-DRAM Based Inference System
10+ hour, 5+ min ago (15+ words) ServeTheHome d-Matrix Building a 3D-DRAM Based Inference System...
d-Matrix Raptor 3D-DRAM Accelerator for Generative Inference at Hot Chips 2026
4+ hour, 1+ min ago (902+ words) This is being done live, so please excuse typos. Model weights keep growing, and the KV cache scales with context length multiplied by batch size. So 64 users at 1M context can mean roughly 935 GB of KV cache. Weights and cache together…...
SK hynix HBM Packaging at Hot Chips 2026
5+ hour, 38+ min ago (795+ words) SK hynix’s Hot Chips 2026 presentation is around high-bandwidth memory (HBM) and advanced packaging. From a slide flip, it looks like they will be covering the 3D stacking, bonding, and system integration choices behind high-bandwidth memory. Like the others, we are doing…...
Last night we entered a memory benchmark against Tencent and Mem0. The score isn't back yet - and I'm publishing it either way.
6+ hour, 36+ min ago (336+ words) Last night, my AI partner and I built a memory system from scratch, tested it about forty different ways, deployed it to the edge, and submitted it to a public leaderboard where the other entries include Tencent, Mem0, Cognee, and MemOS....
The $1 trillion chip era: How 2030???s super-electronics will redefine daily life
11+ hour, 58+ min ago (139+ words) By Hitesh Bhardwaj, GM – Semiconductors & Devices, Mitsubishi Electric India In 2030, the most consequential computer in a factory will not be the one on a manager’s desk. It will be embedded in the robotic arm on the floor: sensing, deciding, and…...
Micron Evolving Memory Architectures for AI at Hot Chips 2026
9+ hour, 24+ min ago (679+ words) Kicking off Hot Chips 2026 Day 0, which has become a big day in itself, Micron is talking about evolving memory architectures for AI. From what it can tell, Micron will be walking through how high-bandwidth memory and advanced packaging have moved…...
Senior Verification Engineer, Memory Subsystem | NVIDIA Corporation
12+ hour, 19+ min ago (427+ words) NVIDIA has continuously reinvented itself. Our invention of the GPU sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. Today, research in artificial intelligence is booming worldwide, which calls for highly scalable and…...